Capability 1.2.2.3

Packaging Accelerators

Definition

The post-fabrication stage where chips are tested, packaged, and assembled into modules or systems ready for integration into AI hardware. Packaging protects chips, enables electrical connectivity, and influences performance characteristics such as latency and thermal efficiency.

Examples

Packaging and testing firms and facilities, such as ASE Technology Holdings, Amkor Technology and JCET Group.

Indicators

Number of packaging and testing facilities operating domestically
Number of AI-grade chips packaged annually

National AI Plan

PLAN COMMITMENT

No commitment

No reference in the plan. No government commitment in the plan aligns with evidence-based recommendation to maintain and monitor (notwithstanding global scarcity). Future plans would benefit from recognising the role of this capability in the ecosystem.

Stocktake

Australian Semiconductor Sector Study: Capabilities, opportunities and challenges for increasing NSW's participation in the global semiconductor value chain. University of Sydney Nano Institute for the NSW Chief Scientist & Engineer. December 2020. https://www.chiefscientist.nsw.gov.au/data/assets/pdf_file/0011/1415/Australian-Semiconductor-Sector-Study.pdf
Australia's semiconductor manufacturing moonshot. Capri and Clark. 21 September 2022. Australian Strategic Policy Institute. https://www.aspi.org.au/report/australias-semiconductor-national-moonshot/

Is the Stocktake missing evidence?

Share additional information for potential future Assessments